PART 01｜

展会聚焦：精准匹配行业新趋势

展会现场，博泉化学展位人气持续高涨，吸引了来自国内外PCB制造、封装载板及电子制造领域的众多客户与合作伙伴驻足交流，现场交流气氛热烈，互动频繁。

▸▸ 脉冲镀铜技术，以深镀能力强与稳定均镀性能赢得广泛关注，亦受到行业专家高度认可。

▸▸ 填孔电镀系列凭借卓越的通盲共镀性能与可靠性表现，成为封装基板客户重点咨询产品。

▸▸ 水平沉铜系列在多种材料适配性与结合力上表现亮眼，收获众多行业客户咨询与交流。

PART 02 技术创新：全面覆盖高端PCB制程需求

博泉化学深耕PCB专用化学品十余年，产品覆盖水平沉铜、脉冲镀铜、填孔电镀、封装基板电镀、软板镀铜、mSAP工艺等核心环节，致力于为高多层板、HDI、封装载板等高端电子制造提供高性能、国产化的化学品解决方案。

赋能国产替代新格局

在国产替代进程加速、高端PCB需求持续释放的时代背景下，博泉化学将以更加开放的姿态、持续创新的技术力量，携手行业伙伴，共同推进中国电子制造高质量发展。

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Guangzhou Sanfu New Materials Technology Co., Ltd

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